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Thermal management of microelectronic equipment: heat transfer theory, analysis methods, and design practices

Yeh, Lian Tuu Chu, R.C. The American Society of Mechanical Engineers (New York, 2002) (eng) English 0791801683 ASME pressbook series on electronic packaging Unknown ELECTRONIC APPARATUS AND APPLIANCES-COOKING; Appendix: p. 349 - 399; Unknown
Physical dimension
xxi, 414 p. 24 cm. ill.
Summary / review / table of contents

No summary / review / table of content available

Copies
Access no. Call number Location Status
02739/05 621.38104 Yeh T SDF Available