Thermal management of microelectronic equipment: heat transfer theory, analysis methods, and design practices
New York
0791801683
ASME pressbook series on electronic packaging
Not available
Appendix: p. 349 - 399
Not available
xxi, 414 p.
24 cm.
ill.
Not available
| Access no. | Call number | Location | Status |
|---|---|---|---|
| 02739/05 | 621.38104 Yeh T | SDF | Available |